- Mobile phone communication industry application
- Solar DC inverter application
- Computer, POS application
- Automotive and automotive peripheral industries
- Heat sink, LED industry application
- Rail transit industry applications
- Electrical tools and small household appliances industry
- New energy industry application
- Controller industry application
- Power supply (DC/DC) industry
- Integrated Circuit Industry Application
- Charging pile industry application
- Material and processing industry applications
- 5G base station, companion application
PC & Set-top Box
PC
- Hot Site: CPU, NB, HDD, NIC, Mosfet.
- Hot Electronics + Heat Sink
- Product Series: TSP3030/TSP3020
- Hot Electronics + Housing
- Product Series: TSP3030/TSP3020
Set-top Box
- Hot Site: IC
- Between IC and heat sink
- Between IC on the PCB back side & housing
LED Lights & Laptop
LED Lights
- Hot site: PCB for DIP LED Assembly
- Aluminum Substrate for COB
- Bronze coated PCB for SMD Assembly
Laptop
- Gap between hot point and housing
- Gap between hot point and heat sink
Water-cooling Plate & Box Bottom of Power Batteries
- Battery Management System (BMS)
- Electrical System
- Structural Parts
- Modules
- Thermal Management System
- Thermal Product Series: TSP150L-GY30+PI, TSP300L-K20-G30+PI
DC-DC Adopter
Telecom
- Antenna
- PCB
- Thermal Interface Materials
- Energikey Product Series: TSP600-K70
Mobile Phone
- Graphite Sheet
- Liquid Cooling Tube
- High thermal conductivity aluminum alloy mullion
- Energikey Product Series: TSP600 Series
LED/LCD TV
- Hot site: TCP IC
- Thermal Pad is under TCP.
- Product Series: TSP300-K20
- Using thermal conductive pad to dissipate the heat from the electronics on the back side of PCB.
- Directly cover it with thermal pad, one side touch the electronics, one side touch the frame.
Batteries of New Energy Automotive
- Thermal pad in New-energy Automotive Battery packs
Regulator and Battery of Motorcycle & Electrical Bicycle
Regulator
- Thermal Product Series: TSP150R-LG45+GL
Battery
- Energikey Product Series: TSP100R
5G Station
Router
- Using thermal conductive material to fill the gap between IC and heat sink.
- Hot Components: CPU, ADSL IC, Switchboard IC.
- Applications: The gaps between ICs and Heat Sinks
- Energikey Product Series: Thermal Conductive Gap Filler TSP300 Series
- Switchboard IC
- ADSL IC
- RAM & Flash Memory Parts
- Wireless Technology IC
Security Camera & Switchboard
Security Camera
- Hot Electronics: IC of image processing
- Applications: Gap between IC and Heat Sink
- Energikey Product Series: Thermal conductive gap filler TSP300-K20 Series
Switchboard
- Using TSP300 series between CPU and heat sink
- Using TSP150 series between IC and heat sink
- Hot points: CPU, IC and other components.
- Applications: The gap between electronic components and heat sink
- Energikey Product Series: Thermal Conductive Gap Filler