Thermal conductivity silica gel as the base material, adding metal oxides and other auxiliary materials, through a special process synthesis of a heat conduction medium material. Heat conduction silica gel sheet only plays the role of heat conduction, forming a good heat conduction path between the heating element and the radiator, and the heat sink, structural fixing parts (fans) together to form a heat dissipation module.
The main purpose of using heat-conducting silica gel sheet is to reduce the thermal contact resistance between the surface of the heat source and the contact surface of the radiating device. Thermal contact resistance is the thermal resistance caused by heat transfer between contact surfaces due to the roughness, flatness and surface treatment of the contact surfaces of the contact objects.
The contact thermal resistance will make the heat conduction channel not smooth, so that the heat accumulation on the contact surface, the heat generated by the heat source can not be quickly and effectively transmitted to the heat dissipation surface, so that the temperature of the heat source rises faster, and the instantaneous overheating and crash will occur in the face of thermal shock.
Thermal conductive silicone can good filling contact clearance, will squeeze the contact surface, air is a poor conductor of heat, will be a serious impediment to heat transfer between the contact surface, the thermal conductivity of silicon sheet added to make contact and better contact fully, truly face-to-face contact, can achieve below 10 degrees in temperature on the reaction temperature.
The thermal conductive silicone sheet has the following advantages relative to the thermal conductive silicone grease and the thermal conductive double-sided adhesive: The range of thermal conductivity and stability of the structure of the process differential closure, reducing the process differential radiator and heat dissipation structure requires EMC, insulation performance, shock absorption and sound absorption effect, installation, testing, and reusability.