Thermal Adhesive Pad

Thermal adhesive pad, takes Acrylic Polymer as the main material, successfully mixed with multiple high-thermal-performance ceramic powder, composite with silicone adhesive. Has the characteristics of high-thermal conductivity and electric resistance, flexible, compressible, adhesive, and strong viscous. Adaptability of temperature range is wide, can fill in the gaps and non-smooth surface, can tightly be stick to hot point and heat sink, conduct the heat out fast.

Advantages:

High and stable thermal conductivity and good viscosity.

Regular Size:

1040MM*50M,1040MM*25M; Thickness:0.1~0.5mm;can be trimmed and die cut, also can be cut into OEM size.

Applications:

Electronic Industries, LED Lights, Hardware Industry, Printing Industry.

Application Pictures

Product Parameters